Sale

2023 IEEE 5th Eurasia Conference on Biomedical Engineering, Healthcare and Sustainability

Mdpi AG
SKU:
9783725814411
|
ISBN13:
9783725814411
$188.89 $166.22
(No reviews yet)
Condition:
New
Usually Ships in 24hrs
Current Stock:
Estimated Delivery by: | Fastest delivery by:
Adding to cart… The item has been added
Buy ebook
This volume represents the proceedings of the 5th IEEE Eurasia Conference on Biomedical Engineering, Healthcare and Sustainability 2023 (IEEE ECBIOS 2023). This conference was held at Chia Nan University of Pharmacy and Science, Tainan, Taiwan on June 2-4, 2023, co-organized by Chia Nan University of Pharmacy and Science, the Institute of Electrical and Electronics Engineers (IEEE) and the International Institute of Knowledge Innovation and Invention (IIKII). Recently, healthcare is experiencing a cross-sector transformation thanks to advances in computing, networking technologies, big data and artificial intelligence. Healthcare is not only changing from reactive and hospital-centered to preventive and personalized medicine but from disease-focused to well-being-centered treatment. Healthcare systems, as well as fundamental medicine research, are becoming smarter, owing to the development of biomedical engineering. Furthermore, with cutting-edge sensors and computer technologies, healthcare services and technologies are used with better efficiency, higher quality, and lower costs. This conference has offered the opportunity for interdisciplinary collaborations between science and engineering technologists in the academic and industrial fields, as well as international networking. From relevant engineering fields, 97 excellent papers were selected through peer review for the publication of the proceedings of IEEE ECBIOS 2023.


  • | Author: Teen-Hang Meen, Kuei-Shu Hsu, Cheng-Fu Yang
  • | Publisher: MDPI AG
  • | Publication Date: Jul 16, 2024
  • | Number of Pages: NA pages
  • | Language: English
  • | Binding: Hardcover
  • | ISBN-10: 3725814414
  • | ISBN-13: 9783725814411
Author:
Teen--Hang Meen, Hsin-Hung Lin, Cheng-Fu Yang
Publisher:
Mdpi AG
Publication Date:
Jul 12, 2024
Number of pages:
NA pages
Language:
English
Binding:
Hardcover
ISBN-10:
3725814473
ISBN-13:
9783725814473