Proceedings of the Munich Symposium on Lightweight Design 2022: Tagungsband zum Münchner Leichtbauseminar 2022 (English and German Edition)
Springer Vieweg
ISBN13:
9783031337574
$180.44
Every year, the Technical University of Munich, the Universität der Bundeswehr München, and the University of Applied Sciences in Munich invite researchers and practitioners to join the Munich Symposium on Lightweight Design. Experts from industry and academia discuss design tools, applications, and new developments. Topics include, e.g., composite structures, SHM, microstructures, material modelling, design for additive manufacturing, numerical optimization and in particular topology optimization in aerospace, automotive and other industries. The talks are summarized in short articles and presented in this volume.
- | Author: Jasper Rieser, Felix Endress, Alexander Horoschenkoff, Philipp Höfer, Tobias Dickhut, Markus Zimmermann
- | Publisher: Springer Vieweg
- | Publication Date: Sep 10, 2023
- | Number of Pages: 156 pages
- | Language: English
- | Binding: Paperback
- | ISBN-10: 3031337573
- | ISBN-13: 9783031337574
- Author:
- Jasper Rieser, Felix Endress, Alexander Horoschenkoff, Philipp Höfer, Tobias Dickhut, Markus Zimmermann
- Publisher:
- Springer Vieweg
- Publication Date:
- Sep 10, 2023
- Number of pages:
- 156 pages
- Language:
- English
- Binding:
- Paperback
- ISBN-10:
- 3031337573
- ISBN-13:
- 9783031337574