Electromigration In Thin Films And Electronic Devices: Materials And Reliability (Woodhead Publishing Series In Electronic And Optical Materials)

Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. "Electromigration in Thin Films and Electronic Devices" provides an up-to-date review of key topics in this commercially important area.

• | Author: Choong-Un Kim
• | Publisher: Woodhead Publishing
• | Publication Date: Aug 19, 2016
• | Number of Pages: 354 pages
• | Language: English
• | Binding: Paperback/Technology & Engineering
• | ISBN-10: 0081016964
• | ISBN-13: 9780081016961