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Through-Silicon Vias For 3D Integration
McGraw-Hill Education
ISBN13:
9780071785143
$172.17
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McGraw-Hill Education
Through-Silicon Vias For 3D Integration
- | Author: John Lau
- | Publisher: McGraw-Hill Education
- | Publication Date: Oct 11, 2012
- | Number of Pages: 512 pages
- | Language: English
- | Binding: Hardcover
- | ISBN-10: 0071785140
- | ISBN-13: 9780071785143
- Author:
- John Lau
- Publisher:
- McGraw-Hill Education
- Publication Date:
- Oct 11, 2012
- Number of pages:
- 512 pages
- Language:
- English
- Binding:
- Hardcover
- ISBN-10:
- 0071785140
- ISBN-13:
- 9780071785143
-
-
-
Sale
